无铅复合钎料的研究及发展

 张春红1,张信永1,王世敏1,张欣1,黄巍2

(1.徐州生物工程职业技术学院 徐州市绿色洁净复合钎料工程技术中心,江苏 徐州 221006;2.南京航空航天大学 机电学院,江苏 南京 210016)
摘要:针对国内外研究者关于含铅钎料的污染问题,引入对无铅钎料的迫切需求。评述了无铅钎料的研究现状及发展趋势。探讨了合金化、颗粒强化、纳米化在新型无铅复合钎料研究中的作用,阐述了无铅复合钎料在电子工业中的应用情况,探讨其物理、化学性能地提升。特别阐述了本课题组在无铅复合钎料方面的研究进展,最后针对无铅复合钎料的未来发展进行展望,分析其研究与应用过程中存在的问题及解决办法,为新型无铅复合钎料的进一步研究提供理论支撑。
.关键词:无铅复合钎料;研究现状;发展趋势 
中图分类号:TB331 文献标志码:A doi:10.3969/j.issn.1006-0316.2018.04.012
文章编号:1006-0316 (2018) 04-0051-05
Study and Development on the Lead-Free Composite Solder
ZHANG Chunhong1,ZHANG Xinyong1,WANG Shimin1,ZHANG Xin1,HUANG Wei2
( 1.Engineering Technology Center of Clean Composite Solder, Xuzhou Vocational College of Bioengineering, Xuzhou 221006, China;
2. School of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China ) 
Abstract:Due to the pollution of lead-containing solder at home and abroad, there is an urgent need to introduce lead-free solder to China. Firstly, the paper reviews the researches  and development trend of lead-free solder. And then, it discusses the role of alloying, particle strengthening and nanocrystal line in the study of new lead-free composite solders. Next, the paper analyzes the application of lead-free composite solders in electronic industry and the physical and chemical properties of the solders. In particular, the research progress in lead-free composite solder is described. Finally, the future development of lead-free composite solder, the problems existing in its research and application, and the possible solutions are analyzed to provide theoretical support for the further study of the new lead-free composite solder.
Key words:Lead-free composite solder;research status;trend in development
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收稿日期:2017-07-31
基金项目:徐州生物工程职业技术学院技计划项目(2015KY02);徐州市科技计划项目(KC15SM041);江苏省333资金资助项目(BRA2017290);江苏省青蓝工程中青年学术带头人项目(2017DT03);江苏省团队访学研修项目(2017TDFX004);江苏省大型工程装备检测与控制重点建设实验室开放课题(JSKLEDC201510);徐州市科技计划项目(KH17017);江苏省六大人才高峰项目(2017DLDTR)
作者简介:张春红(1978-),女,江苏徐州人,硕士,副教授,主要研究方向为机械工程与焊接技术。
 

 

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